Singapore's Applied Materials, Institute of Microelectronic to set up packaging centre

SINGAPORE plans to establish a new 'Centre of Excellence in Advanced Packaging' following the signing of a master research collaboration agreement (MRCA) between Applied Materials and the Agency for Science, Technology and Research's Institute of Microelectronics (IME).


According to Singapore's Minister of Trade and Industry Lim Hng Kiang, who witnessed the signing of the MRCA, the new packaging centre will perform research and development in next generation semiconductor structures, processes and equipment.


"It will develop the know-how to enable the integration of different chips without increasing their overall footprint, improving functionality and performance at lower cost. It is the first of its kind outside of the US for Applied Materials, and will extend the company's R&D reach to Asia," he said.


"Through the centre, Applied Materials will tap on IME's advanced research and development capabilities and infrastructure, as well as access the diverse pool of talent available in Singapore."


The new centre is intended to complement Applied Materials' manufacturing and supply chain operations in the Lion City, as it has brought together the full value chain of activities for its Silicon Systems Group business into Singapore.


The minister said the Singapore government plans to invest S$16.1 billion (US$12.1 billion) in research and development and innovation from 2011 to 2015. "Singapore aims to increase gross expenditure on R&D to 3.5 per cent of GDP by 2015, primarily through the private sector."


He added: "Applied Materials will benefit from IME's leading edge R&D capabilities in 3D Through-Silicon Via technologies, as well as its planned 300mm R&D facility, which when completed, will be one of Asia's most advanced in this field. IME and our universities will also provide a healthy pipeline of skilled industry-ready PhD talents to ensure the successful ramp-up of the centre."
(Source:http://www.schednet.com)